Photomicrographs of Diamond Rod Deposits
Typical Cutting / Grinding Matrix..........................100X | Typical Hardfacing Deposit....................................100X |
Cutting matrix -30+40 mesh diamonds with a soft copper / nickel matrix with some secondary tungsten carbide hard particles. <diamond dark particles> |
Hardfacing matrix -100+120 mesh synthectic diamonds withharder nickel / copper matrix with tungsten carbide and chromium boride particles. <diamond dark particles> |
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